KORNAIN, Zainudin; JALAR, Azman; RASID, Rozaidi. The Investigation of Die Back Edge Cracking in Flip Chip Ceramic Ball Grid Array Package (FC-CBGA). Journal of Science and Technology, [S. l.], v. 2, n. 1, 2010. Disponível em: https://journal.uthm.edu.my/index.php/JST/article/view/240. Acesso em: 13 aug. 2026.